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Reflow soldering temperature curve of the general technical requirements and tes

2015/4/17  人气:165


A, reflux temperature curve during production status:
Reflow soldering is in SMT industry the main method of welding point is formed on the base board assembly, back in the SMT process flow welding is the core technology. Because the design of surface mount PCB, solder paste printing and placement of birth defects such as components, will eventually be concentrated expression in the welding, assembly and surface production in all process control purposes Is to have the good welding quality, if there is no feasible reflow soldering process, any work in front of the art control will lose their meaning. And forms of reflow soldering process for the reflow temperature curve, it refers to the testing points on the surface of the PCB assembly device the curve of temperature change over time. Thus reflux temperature curve is decide the important welding defects